lol投注平台-lol投注app-2020lol投注软件:军队文职

lol外围投注



      lol外围投注

      (Epoxy molding compound (EMC))

      Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials that use a transfer molding system for various electronic parts. They are developed with the advanced technology cultivated through the development of silicone. They have low stress, low war页面 and high thermal conductivity characteristics.

      Shin-Etsu supplies not only general surface mounting, but also highly reliable encapsulation materials for large automotive power modules and various sensors.

      Series Name

      • KMC series

      Applications

      • Automotive parts
      • Semiconductor devices
      • Semiconductor wafers
      • Electronic components
      • Heat-resistant components
      LOL竞猜软件平台
      For Inquiries About This Product
      • Company:
        Shin-Etsu Chemical Co., Ltd.
      • Department:
        Electronics Materials Division, Organic Electronics Materials Dept.
      • Phone:
        +81-3-3246-5231
      
          电竞外围投注平台397415734856197619
          baiduxml lol竞猜app